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激光剝離技術在柔性電子制造領域的應用研究進展 (封面文章)

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing (Cover Paper)

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摘要

激光剝離技術通過脈沖激光輻照致材料燒蝕實現器件向終端基底的轉移,具有一定的材料適用性和工藝兼容性,已成為近年來柔性電子器件制造的新興關鍵技術。從激光剝離技術的基本機制和工藝特點出發,對激光剝離技術在不同柔性電子器件制造中的研究現狀進行調研和介紹,重點闡述激光剝離技術應用中的新工藝與新理論。對激光剝離技術今后的發展方向,特別是超快激光在技術中的應用可能性進行了總結和展望。

Abstract

Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.

Newport宣傳-MKS新實驗室計劃
補充資料

中圖分類號:TN249

DOI:10.3788/CJL202047.0100001

所屬欄目:綜述

基金項目:國家重點研發計劃、國家自然科學基金;

收稿日期:2019-07-22

修改稿日期:2019-09-03

網絡出版日期:2020-01-01

作者單位    點擊查看

季凌飛:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
馬瑞:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
張熙民:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
孫正陽:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
李鑫:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124

聯系人作者:季凌飛([email protected])

備注:國家重點研發計劃、國家自然科學基金;

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引用該論文

Ji Lingfei,Ma Rui,Zhang Ximin,Sun Zhengyang,Li Xin. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001

季凌飛,馬瑞,張熙民,孫正陽,李鑫. 激光剝離技術在柔性電子制造領域的應用研究進展[J]. 中國激光, 2020, 47(1): 0100001

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