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激光剝離技術在柔性電子制造領域的應用研究進展 (封面文章)

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing (Cover Paper)

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Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.









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季凌飛:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
馬瑞:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
張熙民:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
孫正陽:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124
李鑫:北京工業大學激光工程研究院, 北京 100124跨尺度激光成型制造技術教育部重點實驗室, 北京 100124

聯系人作者:季凌飛([email protected])


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Ji Lingfei,Ma Rui,Zhang Ximin,Sun Zhengyang,Li Xin. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001

季凌飛,馬瑞,張熙民,孫正陽,李鑫. 激光剝離技術在柔性電子制造領域的應用研究進展[J]. 中國激光, 2020, 47(1): 0100001

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